Welcome to ESREF 2022 in Berlin!

ESREF 2022, the 33rd European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, will take place in Berlin (Germany) from September 26-29, 2022 at the H4 Hotel Berlin Alexanderplatz.

The conference website is already online, but will be hosted under a different URL this year!

For detailed and up-to-date information, please visit at any time this conference website: https://www.esref2022.org


We are delighted to host the ESREF 2022 in Berlin. After a long period of online events and social distancing, we are in good hope that this event will enable us to meet in person again and to share and promote new ideas longer lasting electronics. This is an important contribution to our society, because an increased lifetime will help to reduce CO2-emissions in electronics production and recycling. But reliability also enables electronics to be used in new applications in extremely harsh environments like space, transport, energy conversion and smart functions. Also this will help us to adress main future societal challenges. A special emphasis will be given on networking: The conference will be the ideal place to establish, reinvigorate and strengthen your contacts with scientists and engineers from all over the world. To make it easier to join us from abroad all session will be streamed live for online viewing.

SCOPE OF THE 2022 CONFERENCE

Authors are invited to submit a 4-page abstract from the following topics:

  • reliability of automotive electronics
  • reliability of nano- and microelectronic
  • reliability of power electronics for energy efficiency and industrial applications
  • reliability of photonics and MEMS
  • security and safety
  • innovative failure diagnostics and quality controls
  • reliability concepts and modelling
  • reliability of wide-bandgap devices
  • advanced packaging and interconnection reliability for power devices
  • reliability for technology sovereignty
  • reliability for the connected world (smart sensors, smart grid, high performance computing and wireless applications)
  • extreme environments and radiation
  • reliability for green electronics
  • AI-based reliability assessments and condition monitoring

KEY DEADLINES

  • Submission for 4 page abstract: March 11, 2022
  • Notification of acceptance: May 2, 2022
  • Final paper (5-6 pages) for review (Elsevier Editorial System): May 19, 2022
  • Final upload to the journal (Elsevier Editorial System): June 9, 2022
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